DC - Digit Concept

SECQUEVILLE EN BESSIN,  Calvados 
France
http://www.digit-concept.com
  • Booth: 327

Worldwide Leader in IC DECAPSULATION equipment’s, over 25 years of experience, we provide the right tool and recipe for full or part Decapsulation, Bonding cut, Cross Sectioning, … by ACID, LASER, PLASMA, MECHANICAL with Artifact Free.

SESAMEACID

SESAMELASER

SESAMEMECHANICAL

SESAMEPLASMA

iPanel™

UP-GRADE or TRADE-IN your old equipment with the last technics … with … New iPanel™ and Options

See our last research presented at IPFA, ISTFA, ESREF

-  New method for decapsulation of copper wire devices using LASER and sub-ambient temperature chemical etch

-  Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices

-  Aluminum Corrosion on Integrated circuits after chemical decap using an automatic wet-etch, root cause and containment

-  New front side access approach with Plasma decapsulation for low-k dielectric/Cu technologies in plastic package

-  Microelectronics Failure Analysis using Laser Ablation of Composite Materials in System in Package

-  Topside De-Layering Trials with a Rotating Polishing Tool (ASAP-1)

-  Decapsulation of Silver-Alloy Wire-Bonded Devices

Have a fruitful ISTFA2017 with DIGIT CONCEPT :)

Brands: SESAMEACID SESAMELASER SESAMEMECHANICAL SESAMEPLASMA SESAMETHERMAL iPanel

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