JIACO Instruments

Delft,  Netherlands 
  • Booth: 215

Visit JIACO Instruments to discuss damage free decapsulation

JIACO Instruments Microwave-Induced-Plasma decapsulation is the new standard for reliable Failure Analysis and Quality Control. The fully automated process is highly selective; critical failure sites in advanced packages e.g. SiP, WCLSP, automotive are retained without process induced damage to challenging materials e.g. Ag, Cu bond wire, GaAs, Cu RDL, BOAC

The JIACO Instruments MIP system has been in the market since mid-2016 and is now in use by many renown global companies for reliable failure analysis and quality control. At ISTFA 2018 JIACO Instruments will be:

  • Presenting its latest research decapsulation together with our industry partners: 'Preserving Evidence for Root Cause Investigations with Halogen-Free Microwave Induced Plasma' at 12:40PM on Wednesday, Oct 31st
  • Part of the 'Tools of the Trade' tour where the the inventor of the MIP decapsulation system will explain how you can use MIP to expose and preserve the original failure sites for critical failure analysis 
  • At booth 215 during the exhibition

We look forward to speaking with you at ISTFA 2018!

Brands: JIACO Instruments Microwave Induced Plasma (MIP) O2 only decapsulation Decapsulation of all bond wire types (Ag, Cu, PdCu, Au & Al) Damage free decapsulation Automated decapsulation process High selectivity

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