Visit JIACO Instruments to discuss damage free decapsulation
JIACO Instruments Microwave-Induced-Plasma decapsulation is the new standard for reliable Reliability Test & Failure Analysis. The fully automated decapsulation process is highly selective; critical failure sites in advanced packages (e.g. SiP, WLCSP, 2.5D, 3D) are retained without process induced damage to challenging materials e.g. Ag, Cu bond wire, GaAs, Cu RDL, BOAC
The JIACO Instruments MIP system has been in the market since mid-2016 and is now in use by many renown global companies for reliable failure analysis and quality control. At ISTFA 2021 JIACO Instruments will be:
- Presentor in the 'Tools of the Trade' tour where you will hear how you can use MIP to expose and preserve the original failure sites for critical failure analysis
- At booth 818 during the exhibition
We look forward to speaking with you at ISTFA 2021!
Brands: JIACO Instruments
Microwave Induced Plasma (MIP)
Atmospheric
O2 only decapsulation
Decapsulation of all bond wire types (Ag, Cu, PdCu, Au & Al)
Artifact-free decapsulation
Automated decapsulation process