30 years of IC DCapsulation tools
1992-2022
Worldwide Leader in IC DECAPSULATION equipment’s, over 30 years of experience, we provide the right tool and recipe for full or part Decapsulation, Bonding cut, Cross Sectioning, … by ACID, LASER, PLASMA, MECHANICAL with Artifact Free.
SESAMEACID
SESAMEPLASMA included iMIP 2022 release
SESAMELASER
SESAMEMECHANICAL
iPanel™
UP-GRADE or TRADE-IN your old equipment with the last technics … with … New iPanel™ and Options
See our last research presented at IPFA, ISTFA, ESREF
- New method for decapsulation of copper wire devices using LASER and sub-ambient temperature chemical etch
- Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices
- Aluminum Corrosion on Integrated circuits after chemical decap using an automatic wet-etch, root cause and containment
- New front side access approach with Plasma decapsulation for low-k dielectric/Cu technologies in plastic package
- Microelectronics Failure Analysis using Laser Ablation of Composite Materials in System in Package
- Decapsulation of Silver-Alloy Wire-Bonded Devices
Have a fruitful ISTFA2022 with DIGIT CONCEPT :)
Brands: SESAMEACID
SESAMEPLASMA included iMIPlasma
SESAMELASER
SESAMEMECHANICAL
SESAMETHERMAL
iPanel