Visit BSET EQ for your package opening needs in booth 922
BSET EQ manufactures gas plasma systems to meet the needs of the semiconductor failure analysis industry. We are proud to be the world leader in package opening for failure analysis using gas plasma and laser technologies.
Since 1999 our equipment has proven to be first to solve, and best choice for meeting new and old challenges with regards to specialty I.C. DECAP. Today our PLASER™ DECAP tool represents a collection of twenty two years of prior art for the application. The system and its proprietary plasma source(s) and automation is proving to be the industry standard.
With our equipment and processes we were first to expose sensitive wire bond technologies on BGA, Cu, Cu/Pd and SILVER wires and architectures. Our additional offerings include our popular FA2000 tabletop and FA3000 RIE/ICP. These etchers provide non- destructive delayering processes for your packaged devices or wafers. Visit us at our booth #922 and explore www.bseteq.com for more information.