Checkpoint Technologies’ InfraScan product family provides industry-leading laser scanning and photon emission failure analysis and debugging for today’s low-voltage and ever-shrinking devices. The InfraScan product family includes Checkpoint’s custom-designed solid immersion lens with NA up to 3.3, Shortwave Probing SWP™ in the visible delivering optical resolution for 7nm and beyond. Checkpoint’s proprietary MCT camera design is capable of observing transistors with basis voltages below 400 mV. These technologies are available in multiple custom configurations either top-down (InfraScan TDM) or inverted (InfraScan ES400) to meet the changing needs of any failure analysis or debugging laboratory.