Our first product was an innovative Laser Assisted Chemical Etching (LACE) system, VarioEdit, that enables rapid, ultra-thin preparation of silicon ICs for focused ion beam circuit edit.
The thickness measurement system in the VarioEdit proved to be very effective for accurate feedback. Our second product was soon launched and became the VarioMetric measuring microscope. Our third product, VarioProfile, was again developed for customers who wanted to map both the thickness and curvature of packaged IC.
We realized that we could design a CNC that would outperform existing solutions. Varioscale proposed and was funded to develop the first prototype of the VarioMill under a US Government sponsored program called CAT. Today, VarioMill is routinely used by to prepare ultra-thin IC die, packaged IC and IC in modules.
More recently, Varioscale has taken on the challenge of developing Cybersecurity solutions to delayer and image an entire 10 nm integrated circuit. Our state-of-the-art research laboratory funded by the US Government has achieved delayering, imaging, and data processing that is orders of magnitude faster and larger than any other effort in the world.
Brands: VarioMetric (TM)
VarioVmill (TM)
VarioProfile (TM)
VarioEdit (TM)