JIACO Instruments

Delft,  Netherlands 
  • Booth: 315

Visit JIACO Instruments to discuss damage free decapsulation

JIACO Instruments Microwave-Induced-Plasma decapsulation is the new standard for reliable Reliability Test & Failure Analysis. The fully automated decapsulation process is highly selective; critical failure sites in advanced packages e.g. SiP, WCLSP, automotive are retained without process induced damage to challenging materials e.g. Ag, Cu bond wire, GaAs, Cu RDL, BOAC

The JIACO Instruments MIP system has been in the market since mid-2016 and is now in use by many renown global companies for reliable failure analysis and quality control. At ISTFA 2019 JIACO Instruments will be:

  • Presenting its latest research decapsulation together with our industry partners: 'Artifact-Free Decapsulation of Silver Wire Bonded Semiconductor Devices Using Microwave Induced Plasma’ at 08:00AM on Thursday, November 14th
  • Presentor in the 'Tools of the Trade' tour where you will hear how you can use MIP to expose and preserve the original failure sites for critical failure analysis 
  • At booth 315 during the exhibition

We look forward to speaking with you at ISTFA 2019!

Brands: JIACO Instruments Microwave Induced Plasma (MIP) O2 only decapsulation Decapsulation of all bond wire types (Ag, Cu, PdCu, Au & Al) Damage free decapsulation Automated decapsulation process High selectivity

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