Let's CLEAVE AND SCRIBE, you will be Surprised!
LatticeGear is the premier supplier of cleaving solutions, including table top tools and accessories. Cleaving is a quick, dry, clean process for downsizing and cross-sectioning a variety of materials including glass, sapphire, III-V, SiC, and silicon. LatticeGear’s unique solutions cleave freestanding structures deposited by e-beam lithography, glass with mirror finish facets, and bonded materials (bonded wafers, SOI). Downsize wafers or single dice cleanly in the cleanroom, and decap MEMS packages without the wet chemical process. Demo our patented LatticeAx® high accuracy cleaving system and FlipScribe® scriber to gain a new perspective on cleaving and scribing for labs and nanofab cleanrooms.
Brands: LatticeAx®, FlipScribe®, FlexScribe, Small Sample Cleaver, LatticeScriber, Small Sample Pliers