Santa Clara,  CA 
United States
  • Booth: 313

Welcome to SELA booth 313 to see latest cleaving solutions!

SELA presents full range of cleaving solutions.
For over 25 years SELA develops and delivers advanced cleaving solutions for failure analysis and yield management in the semiconductor industry and analytical purposes in research laboratories and universities around the world. SELA’s patented Nano Cleaving, Micro Cleaving and Perfect Cleaving technologies address emerging and challenging requirements of the cross-section for a wide variety of structures, materials and substrates. SELA cleaving ensures high accuarcy, high quality and high throughput cross-sectioning. SELA's smart cleaving equipment advanced with high resolution and high magnification optical systems, IR observation and liquied nitrogen spraying. 

SELA's latest developments provide capabilities of high accurate cleaving of 1-3 microns features on extremely small samples and dies in sizes down to 300x200 microns in just a minute!
More information at SELA web site:

Brands: Nano Cleaving, Micro Cleaving, Perfect Cleaving, MC600i, MC10, MC10i, MC20, PCM

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